Press Release

Chicago, Ill – August 10, 2020 – The Small Form Factor Pluggable Double Density (SFP-DD) Multi-Source Agreement (MSA) Group is pleased to announce its updated 4.1 hardware specification and drawings for the SFP-DD pluggable interface designed to enable high-speed 100+ Gbps, high-density networking equipment. The SFP-DD form factor uses 2-lane pluggable modules, is backward compatible with SFP+ and offers improved host to module management communication based on a Two-Wire-Interface (TWI).   SFP-DD revision 4.1 hardware specification includes added features to support ResetL, dual function IntL/TXFaultDD and ePPS. Newly added timing tables will also allow for low speeds signals, soft control and module status. The former chapter 7 Management Interface is now part of chapter 4, Electrical Specification. The updated hardware specification includes port mapping, optical connectors and module color coding moved out of Mechanical and Board Definition chapter 5 and into a new chapter 5. Lastly, TS-1000 Normative Module and Connector performance requirements were added as Appendix A.   New approach enables greater interoperability Targeting support of optical modules up to 3.5 W, the SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanical interoperability for module components produced by different manufacturers while still enabling the use of legacy SFP modules. This updated specification supersedes previous versions and has updated mechanical connector dimensions. Users should note that the connector dimensions specified in the 4.1 supersede all previous versions.  SFP-DD MSA promoters include Alibaba, Broadcom, Cisco, Dell EMC, HPE, Huawei, II-VI Incorporated, Intel, Juniper Networks, Lumentum, Molex, Nvidia and TE Connectivity. Contributors include Accelink, Amphenol, AOI, Eoptolink, FIT, Fourte, Genesis, Hisense, Infinera, Innolight, Maxim Integrated, Multilane, Nokia, Oclaro, Senko, Source Photonics, US Conec and ZTE.  To download the SFP-DD updated hardware specification and drawings or to explore opportunities for becoming a contributing member, please visit the MSA website www.sfp-dd.com. 

Dublin, Ireland – September 18, 2019 – The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group is pleased to announce the release of its first Management Interface Specification (MIS). The SFP-DD MIS may be used by 2-lane pluggable modules with host to module management communication based on a Two-Wire-Interface (TWI). Developed to allow host and module software implementers to utilize a common code base across a variety of form factors, the SFP-DD MIS provides a set of core functionality that all modules must implement and a set of optional features whose implementation is advertised in the module memory map. This approach allows host software implementers to read and react to optional module capability advertisements while ensuring interoperability with all modules at a basic level. SFP-DD MSA promoters include Alibaba, Broadcom, Cisco, Dell EMC, Finisar, HPE, Huawei, Intel, Juniper Networks, Lumentum, Mellanox, Molex and TE Connectivity. Contributors include Accelink, Amphenol, AOI, Foxconn Interconnect Technology, Fourte, Genesis, Hisense, Infinera, Innolight, Maxim Integrated, Multilane, Nokia, Senko, Source Photonics, US Conec and ZTE. A characteristic common to all SFP-DD MIS compliant modules is that management data is transferred over a TWI, using a 256 byte addressable memory window, with mechanisms to dynamically page data of a much larger management memory space into the upper half of the host addressable memory window. SFP-DD MIS compliant pluggable modules are 2-lane module form factors. “Working collectively with all the MSA members, we are pleased to introduce the SFP-DD MIS,” said Scott Sommers, founding member and MSA chairman. “With this new release, the MIS will enable the adoption of the SFP-DD form factor as the next generation of SFP-DD modules, connectors and cage systems.” Many MSA members will be demonstrating SFP-DD at the upcoming European Conference on Optical Communication, Sept 23rd-25th in Dublin, Ireland.

December 28th 2018 – SFP-DD MSA announces an updated 2.1 specification. This specification supersedes previous versions and has updated mechanical connector dimensions. Users should note that the connector dimensions specified in the 2.1 supersede all previous versions.

Two-lane 3.5 W electrical interface enables high-speed enterprise networking Transceiver form factor doubles bandwidth and supports fast line rates Backwards compatibility with existing SFP interfaces and new SFP-DD styles Rome, Italy – September 17, 2018 – The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group announces the release of the v2.0 specification for the SFP-DD pluggable interface. Dedicated to fostering the development of next-generation SFP form factors used in DAC and AOC cabling, and optical transceivers, the MSA consortium released the initial SFP-DD specification version 1.0 in September 2017 and earlier this year released version 1.1. The newly updated specification version 2.0 reflects enhancements to the mechanicals, extended modules and enhanced polarizing key of the high-speed, high-density SFP-DD electrical interface, targeting support of up to 3.5 W optical modules in an enterprise environment. The SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanical interoperability for module components produced by different manufacturers. The innovative electrical interface is designed to support two lanes that operate up to 25 Gbps NRZ or 56 Gbps PAM4 per lane modulation — providing aggregate bandwidth of 50 Gbps NRZ or 112 Gbps PAM4 with excellent signal integrity. ‘’Through strategic collaborations we work to increase speed, density and scalability in next-generation servers,” said Scott Sommers, Chair of the SFP-DD MSA. “We effectively enhance the roadmap in network applications to meet the challenging demands data centers and enterprise networking platforms are up against.” It is anticipated that many MSA members will be demonstrating SFP-DD at the upcoming European Conference on Optical Communication, Sept 23rd-27th in Rome, Italy. SFP-DD MSA founding members include Alibaba, Broadcom, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise, Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex, and TE Connectivity. Contributing members are Accelink, Amphenol, AOI,

Two-lane 3.5 W electrical interface enables high-speed enterprise networking Transceiver form factor doubles bandwidth and supports fast line rates Backwards compatibility with existing SFP interfaces and new SFP-DD styles Chicago, IL – January 26, 2018 – The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group is pleased to announce the release of an updated specification for the SFP-DD pluggable interface. Dedicated to fostering the development of next-generation SFP form factors used in DAC and AOC cabling, and optical transceivers, the MSA consortium released the initial SFP-DD specification (version 1.0) in September 2017. The updated specification (version 1.1) reflects enhancements to the mechanicals and drawings of the high-speed, high-density SFP-DD electrical interface comprising a module and cage/connector system targeting support up to 3.5 W optical modules in an enterprise environment. The SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanical interoperability for module components produced by different manufacturers. The innovative electrical interface is designed to support two lanes that operate up to 25 Gbps NRZ or 56 Gbps PAM4 per lane modulation—providing aggregate bandwidth of 50 Gbps NRZ or 112 Gbps PAM4 with excellent signal integrity. In combination, an SFP-DD server port and QSFP-DD switch ports can effectively double port density in network applications. The SFP-DD interface helps meet increased demand for port density and scalability in next-generation servers. Extending speed and density, the SFP-DD electrical interface expands on the existing SFP pluggable form factor, a widely adopted interface used in data centers and other networking platforms. A key guiding principle of the MSA 1.1 specification is backward compatibility. The SFP-DD port is backwards compatible with legacy SFP and SFP+ style cables, modules and AOCs, and all new SFP-DD electrical interfaces. SFP-DD MSA founding members include Alibaba, Broadcom, Cisco, Dell EMC,

Fourteen industry leaders join forces to double lane density and data speed of SFP transceivers Berlin, Germany – July 12, 2017 – The SFP-DD Multi-Source Agreement (MSA) Group has announced intent to develop the specification for a high-speed, double-density small form-factor pluggable (SFP-DD) interface. Under the MSA, participating companies will address the technical challenges of achieving a double-density SFP interface and ensuring mechanical interoperability for module components produced by different manufacturers. New SFP-DD based networking equipment will support legacy SFP modules and cables, as well as new double density products. The SFP-DD MSA founding members include Alibaba, Broadcom, Brocade, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise, Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex, and TE Connectivity. Members of the MSA will develop operating parameters, signal transmission speed goals, and protocols for the SFP-DD interface, which expands on the SFP pluggable form factor, a widely adopted electrical interface used in data centers and other networking platforms. Multi-vendor SFP modules and assemblies are available today in a range of data rate speeds and reaches to support data transmission applications including hubs, switches, routers and servers. The SFP interface’s single electrical lane operates up to 25 Gbps NRZ or 56 Gbps PAM4. The new SFP-DD electrical interfaces will be designed to support 2 lanes that operate up to 25 Gbps NRZ or 56 Gbps PAM4 per lane, providing solutions up to 50 Gbps or 112 Gbps PAM4 aggregate. By doubling the lane density and data speed of SFP transceivers, the SFP-DD specification will address increased port density and scalability in next-generation applications, with a primary focus on the server side interconnect. An SFP-DD server port along with QSFP-DD switch ports provides an overall doubling of the port density in network applications. Participation of industry leaders in the SFP-DD MSA will enable faster